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Template Revision B  

                 

 

 

 

 

  

PSG instructions for this template are available a

EL-MF877-01

  

  

Product End-of-Life Disassembly Instructions

 

Product Category: Monitors and Displays

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP B191 LED Backlit Monitor 

 

 

 

 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions 

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU 
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as 
applicable. 

Item Description 

Notes 

Quantity 
of items 
included 
in product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
           

Batteries 

All types including standard alkaline and lithium 
coin or button style batteries              

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

Liquid Crystal Displays (LCD) with a surface 
greater than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps             

Cathode Ray Tubes (CRT) 

            

Capacitors / condensers (Containing PCB/PCT) 

            

13 

Electrolytic Capacitors / Condensers measuring 
greater than 2.5 cm in diameter or height 

            

External electrical cables and cords 

            

Gas Discharge Lamps 

            

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 
already listed as a separate item above) 

            

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

Components and waste containing asbestos 

            

Components, parts and materials containing 
refractory ceramic fibers 

            

Содержание B191

Страница 1: ...t Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 3 Batteries All types including standard alkaline and lithium coin or button style batteries 0 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries 0 Liquid Crystal Displays LCD with a surface greater than 100 sq cm Includes background illumi...

Страница 2: ...Description 4 Description 5 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 1 Dismantle the hinge assy 2 Dismantle the back cover of monitor 3 Dismantle the screws from Mainframe 4 Pull out the PIN of cables separate the mainframe and Panel 5 Dismantle the PCBA screws and disconnect the conn...

Страница 3: ...1 11 Mechanical Instructions Step Figure Description Remove the Base ASSY Push the key to remove the base assy Remove the rear cover Remove the screws to remove the rear cover ...

Страница 4: ...2 Remove the tapes and the pins Remove the tapes and the pins Remove the screws Remove the screws ...

Страница 5: ...3 Remove the FFC cable Remove the FFC cable Remove the Key Board Remove the keyboard ...

Страница 6: ...4 Remove the mainframe Remove the mainframe Remove boards Remove the Mylar and screws to remove the main board and power board ...

Страница 7: ...5 The mainframe The mainframe Bezel Bezel ...

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