HP 27m, Инструкция по разборке

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EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Cross screwdriver
Hexagon screwdriver
Opening plasitc picks
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Separate base(chassis) and neck by hand, then unlock monitor head and column by releasing button.
2. Separate front bezel and rear cover along the side gap by opening plsatic pick and separate front bezel by hand.
3. Remove all the acetate tapes from LVDS FFC, disassemble the internal wire, LVDS FFC from connector by hand
4. Release I/O port screws on PCBs by hexagon screwdriver, tear Alu tape from chassis then separate LVDS FFC and all
connector on PCBs.
5. Disassemble metal hinge with screwdriver, then release the screws to separate hinge from plastic part of neck, and
release screws to separate hinge top bracket from hinge..
6.
7.
8.
9.
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).