EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Philips Head Screw Driver
# 2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the screws securing the bulkhead to PCA using a Philips Head screw driver (16 per for J8729A).
2. Remove the EMI gasket from the top (1 per) and the side (2 per) of the bulkhead. Refer to Picture 1 for more details.
3. Remove the screws securing the clip to heat sink using a Philips Head screw driver (14 per for J8729A). Refer to
Picture 2 for more details
4. Separate the clip (7 per for J8729A) & standoff (14per for J8729A) and the heat sink.
5. Remove the screws securing the guide pins to the PCA using a Philips Head screw driver(1 per for J8729A. Refer to
Picture 3 for more details. Note the picture shown below is a 16slot fabric module for illustration purposes, you should
only see 1 guide pin for a slot fabric module.
6. Separate the guide pins, heat sink, clip, standoff, EMI gasket, PCA and bulkhead
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3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
