HIMA HIMax X-MIO 6 01, Руководство пользователя

Страница: 4 / 72

Table of Contents X-MIO 7/6 01
Page 4 of 72 HI 801 305 E Rev. 5.00
3.7 System Cable 32
3.7.1 System Cable X-CA 005 32
3.7.2 System Cable X-CA 008 33
3.7.3 Cable Plug Coding 34
4 Start-up 35
4.1 Mounting 35
4.1.1 Wiring Inputs Not in Use 35
4.2 Mounting and Removing the Module 36
4.2.1 Mounting a Connector Board 36
4.2.2 Mounting and Removing the Module 38
4.3 Line Monitoring (Short-Circuits and Open-Circuits) 40
4.4 Overspeed Trip Module Sampling 41
4.4.1 2oo3 Evaluation 42
4.4.2 Threshold Monitoring 42
4.4.3 Gradient Monitoring 42
4.4.4 Trip Function 43
4.5 Configuring the Overspeed Trip Module in SILworX 44
4.5.1 The Module Tab in the Detail View for the Redundancy Group 45
4.5.2 The Module Tab in the Detail View for the Individual Modules 46
4.5.3 Tab: I/O Submodule DO 02 49
4.5.4 Tab: I/O Submodule DO 02: Channels 49
4.5.5 Tab: I/O Submodule DI 02 50
4.5.6 Tab: I/O Submodule DI 02: Channels 51
4.5.7 Tab: I/O Submodule CT 03 52
4.5.8 Tab: I/O Submodule CT 03: Channels 53
4.5.9 Submodule Status DO 02 [DWORD] 54
4.5.10 Submodule Status DI 02 [DWORD] 54
4.5.11 Submodule Status CT 03 [DWORD] 55
4.5.12 Diagnostic Status [DWORD] 56
4.6 Variants 58
4.6.1 Wiring the Modules via Connector Boards X-CB 018 02 and X-CB 018 06 59
4.6.2 Wiring the Modules via FTA using System Cables 60
5 Operation 61
5.1 Handling 61
5.2 Diagnosis 61
6 Maintenance 62
6.1 Maintenance Measures 62
6.1.1 Loading the Operating System 62
6.1.2 Proof Test 62