1
Dimensions are in millimeters (inches)
www.fcai.fujitsu.com
Specifications
subject to change
FOR BOARD-TO-CABLE CONNECTION
240 SERIES (GENERAL-PURPOSE TYPE)
■
FEATURES
• 1.27 mm (0.050 in.) pitch contact arrangement in two
rows enables high-density mounting.
• Connectors with 20 to 96 contacts are available for
various purposes.
• Discrete-wire (AWG #28, #30) I/O cables can be
assembled by IDC. Metal covers completely protect
sockets from EMI.
• Bellows contacts ensure stable contact preventing
pins from bending. The bellows contacts also have
excellent stability with repeated insertion and
extraction.
• Tails are spaced in a four-row staggered arrangement
(2.54 mm
×
1.905 mm) (0.100 in.
×
0.075 in.) for easy
PC board design.
• Insulation is UL-approved (94V-0) and is washable.
• An FCN-230 EMI cover and dust cap can be used
together.
■
SPECIFICATIONS
■
MATERIALS
Item
Insulator
Conductor
Plating
Materials
Polyester (UL94V-0)
Copper alloy
Contact
Terminal
Gold plating
Palladium plating
Specifications
–55
°
C to +105
°
C
DC 1 A
AC 240 V
35 m
Ω
max. (DC 6 V, 0.1A)
1000 M
Ω
min. (DC 500 V)
AC 750 V for 1 minute
4.5 kg max. (20 pins)
0.6 kg min. (20 pins)
1.6 mm (0.063 in.) thick
IDC: AWG #28 and #30 stranded wires with
φ
0.5 to 0.88 mm (0.020 to 0.035 in.)
insulation diameter.
Soldering: AWG #26 max. (reference)
(The applicable wires depend on the number
of contacts. See the descriptions of IDC
sockets and metal covers.)
Item
Operating temperature range
Current rating
Voltage rating
Contact resistance
Insulation resistance
Dielectric withstand voltage
Insertion force (kg)
Withdrawal force (kg)
Applicable PC board
Applicable wire (standard)
