Foundry FastIron SuperX, Руководство по установке оборудования

Страница: 178 / 198

Foundry FastIron Configuration Guide
A - 10 © 2008 Foundry Networks, Inc. December 2008
5. Install the full Layer 3 software. Note the precautions in “Before Installing the Software” on page A-11.
6. Reboot the device.
Detailed Procedure
This section describes how to install the hardware and software contents in the Layer 3 upgrade kit.
Hardware Installation
You need a Phillips-head screwdriver and an ESD wrist strap to perform this procedure. You also need a static-
free work area.
To perform the upgrade:
1. If your Foundry device does not have redundant management modules, power down the chassis and remove
the power cables from the chassis power supplies.
WARNING: Disconnect the power cord from all power sources to completely remove power from the device.
2. Put on the supplied ESD wrist strap and attach the clip end to the ESD connector on the chassis, or a metal
surface (such as an equipment rack), to act as ground.
3. Disassemble the management module on which the DIP key will be installed (see Figure A.1 for the FSX,
Figure A.2 for the SX 800 or Figure A.3 for the SX 1600).
• Use a Phillips-head screwdriver to loosen and remove the two screws on the ends of the module.
• Pull the card ejectors towards you, and away from the module front panel. This action unseats the
module from the backplane.
• Slide the management module out of the chassis and place it on a static-free work area.
4. Remove the DIP key from the package and align the lead pins over the DIP socket in the following location:
• U63 on SX 800 and SX 1600 management modules
• U53 on SuperX management modules
The circular or semicircular indentation on the DIP key indicates the position of lead pin 1. If the DIP key has
a circular indentation, it is aligned with pin 1. The semicircular indentation on the DIP key is located on the
same end as pin 1. Pin 1 is located to the left of the semicircular indentation.
Align the semicircular indentation on the DIP key with the semicircular cut-out on the DIP socket. See the
appropriate illustration:
• “DIP Key Insertion for the IPv6 and IPv4 8-port GbE Management Modules (SX-FI8GMR6 and SX-
FI8GMR4)” on page A-5
• “DIP Key Insertion for the IPv6 2-port 10-GbE Management Modules (SX-FI2XGMR6)” on page A-6
• “DIP Key Insertion for the IPv4 2-port 10-GbE Management Modules (SX-FI2XGMR4)” on page A-7
• “DIP Key Insertion for the IPv6 and IPv4 0-port Management Modules (SX-FIZMR)” on page A-8
• “DIP Key Insertion for the FastIron SuperX Management Modules (SX-FI12GM-4, SX-FI12GM2-4, SX-
FI12GM-6 and SX-FI12GM2-6)” on page A-8
Pin 1 S emicirc u l a r indent a tion