6 Oryx Physical Interface
6.7
Mounting Your Oryx
Using the Case
The case is equipped with the following mounting holes:
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Four (4) M4.0 x 0.7 mounting holes on each side of the case
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One (1) 1/4-20 UNC mounting hole on the bottom of the case (standard and large case only)
6.8
Case Temperature and Heat Dissipation
You must provide sufficient heat dissipation to control the internal operating temperature of the camera.
The camera is equipped with an on-board temperature sensor. It allows you to obtain the temperature of the camera
board-level components. The sensor measures the ambient temperature within the case.
As a result of packing the camera electronics into a small space, the camera can become hot to the touch
when running. This is expected behavior and will not damage the camera electronics.
To reduce heat, use a cooling fan to set up a positive air flow around the camera, taking into consideration the following
precautions:
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Mount the camera on a heat sink, such as a camera mounting bracket, made out of a heat-conductive material
like aluminum.
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Make sure the flow of heat from the camera to the bracket is not blocked by a non-conductive material like
plastic.
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Make sure the camera has enough open space around it to facilitate the free flow of air.
To access temperature information query the GenICam Device Control feature DeviceTemperature.
4/9/2020
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Integrated Imaging
Solutions Inc.
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FLIR Oryx
®
Installation Guide
19
