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FIBOCOM FG621-LA Series Hardware Guide
Page 10 of 57
Specification
Temperature
Normal operation: -30°C~+75°C
①
Extended operation: -40°C~+85°C
②
Storage: -40°C~+85°C
③
Power
consumption
(TBD)
Power-off leakage current: ≤ 100uA
Base current: ≤ 2.5mA
Sleep mode: ≤ 4.5mA
Idle mode: ≤ 50mA
Physical
characteristic
s
Package: LGA 299Pin
Size: 39.5mm×37mm×2.6 mm
Weight: About 8.3g
Interface
Antenna
Antenna: Main×1, DIV×1
Function
interface
(U)SIM 3.0V/1.8V
USB 2.0×1
Status Indicator
UART×4, PCM, I
2
C, SDIO, SPI, GPIOs, RESET_N, PWRKEY
ADC×2
Software
Protocol stack IPV4 and IPV6
AT command
3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT
Firmware
update
USB
Voice service
VoLTE, AMR, DTMF and caller ID
SMS service
Point-to-point MO, MT, Text and PDU modes
Note:
indicates that the module works normally within this temperature range, and the related
①
performance meets the requirements of 3GPP standards.
②
indicates that the module works normally within this temperature range, and the baseband
and RF functions are normal, but some indicators may exceed the range specified in 3GPP
standards. While the temperature returns to the normal operating range of the module, all the
indicators of the module meet the requirements of 3GPP standards.