MT6M08855 a
Fuji Small IPM (Intelligent Power Module)
P633A Series
6MBP**XS*060-50
Chapter 6 Mounting Guideline and Thermal Design
Application Manual
October 2021
Страница 1: ...MT6M08855 a Fuji Small IPM Intelligent Power Module P633A Series 6MBP XS 060 50 Chapter 6 Mounting Guideline and Thermal Design Application Manual October 2021...
Страница 2: ...sor motor inverter Fan motor inverter for room air conditioner Compressor motor inverter for heat pump applications etc If you need to use a semiconductor product in this application note for equipmen...
Страница 3: ...MT6M08855 a Fuji Electric Co Ltd All rights reserved 1 Soldering to PCB 6 2 2 Mounting to Heat sink 6 2 3 Heat Sink Selection 6 4 Chapter 6 Mounting Guideline and Thermal Design 6 1...
Страница 4: ...Sink When mounting the product to a heat sink please refer to the following recommended fastening order Uneven fastening due to excessive torque might lead to destruction or degradation of the chip F...
Страница 5: ...ease with high thermal conductivity should be applied evenly to the contact surface between the product and the heat sink The stencil mask method Fig 6 3 is recommended to control the appropriate ther...
Страница 6: ...the chips The over heating OH protection function works when the IGBT junction temperature exceeds the maximum junction temperature rating However if the temperature rises too quickly the OH protectio...
