Product Installation
M50 SERIES
· 15 ·
Warning
Please make sure the total carrying capacity of the wall or ceiling is at least four
times as much as the total weight of the PC (including cabinet bracket and
accessory expansion modules).
3.3 Application Environment of Fully-enclosed Computer
Dissipation methods of fully-enclosed computer: thermal conduction and thermal
radiation methods are deployed to dissipate heat generated by internal components to
the chassis, which in turn passes the heat to the external space by thermal radiation
and convection. The inside of the chassis, the chassis and the space where the
computer is located exchange heat with each other continuously and sufficiently. The
requirements for the working area or space where the PC is located are as follows:
The largest dimension of the fully-enclosed PC is L, the gravity direction is Y, the
upper space of the PC is +Y, while the lower space of the PC is –Y, as shown in the
Picture 1 and Picture 2 below.
1. Upper space +Y > 2L: above the PC, there should be a space at least twice the
largest dimension of the PC;
2. Low space -Y > L: below the PC, there should be a space at least the same size as
the largest dimension of the PC;
3. There should be at least 0.5L space for the other four directions (front, rear, left,
right);
4. In the above heat exchange areas, there should be no other heat generating object or
space divider, and no other article is allowed to be placed on the surface of chassis;
5. There should be heat exchange channel between heat exchange area and outside
natural environment, such as air moving equipment, and air inlet/outlet to ensure air
circulation, etc.;
Содержание M50 Series
Страница 1: ...M50 SERIES 微型低功耗无风扇嵌入式整机 Micro low power fanless embedded PC Version C00 ...
Страница 17: ...产品介绍 M50 SERIES 9 1 3 2 内部布局 设备内部布局图 位置 描述 1 主板 2 IO 板 3 硬盘 1 3 3 操作控件 警告 开 关按钮信号不会切断设备电源 小心 设备执行硬件复位时可能会丢失数据 ...
Страница 23: ...安装产品 M50 SERIES 15 图 2 热交换区域空间 安装时外壳散热翅片顺着机柜内的通风方向会有更好的散热效果 推荐下面 两种通风方式 如图 3 和图 4 所示 图 3 左右横向通风 图 4 向上通风 ...
Страница 25: ...设备连接 M50 SERIES 17 4 3 将设备连接到电源 将设备连接到电源的步骤 把配件中的适配器上的端子插入 图示接口 中 危险 雷暴雨期间断开电源和数据电缆 注意 必须断开电源连接器才能将设备与电源完全隔离 ...
Страница 45: ...BIOS 功能介绍 M50 SERIES 37 Advanced Super IO Configuration ...
Страница 54: ...BIOS 功能介绍 46 M50 SERIES North Bridge 显示当前系统安装内存的容量 内存类型等信息 为动态侦测信息 Intel IGD Configuration ...
Страница 58: ...BIOS 功能介绍 50 M50 SERIES Administrator Password 此项用于设置管理员密码 User Password 此项用于设置普通用户密码 Boot ...
Страница 68: ...BIOS 功能介绍 60 M50 SERIES Advanced Super IO Configuration 该项提供本平台的串口 COM1 4 ...
Страница 74: ...BIOS 功能介绍 66 M50 SERIES USB Configuration 该项提供关于 USB 控制器的配置 Legacy USB Support ...
Страница 77: ...BIOS 功能介绍 M50 SERIES 69 Chipset 该项提供关于平台芯片组的配置 System Agent SA Configuration 该项提供关于 System Agent 功能的配置 ...
Страница 80: ...BIOS 功能介绍 72 M50 SERIES PCH IO Configuration 该项提供 Intel PCH 芯片的功能配置 ...
Страница 82: ...BIOS 功能介绍 74 M50 SERIES HD Audio Configuration 该项提供关于声卡的配置 Security ...
Страница 95: ...扩展安装 M50 SERIES 87 2 取出MiniPCI E M SATA 8 4 SIM卡扩展 安装SIM卡 安装SIM的步骤 1 松开图示9个螺钉 卸下 底盖 2 取出M SATA 再安装SIM 卡 ...
Страница 96: ...扩展安装 88 M50 SERIES 拆卸SIM卡 拆卸SIM卡的步骤 1 松开图示9个螺钉 卸下 底盖 2 取出M SATA 再取出SIM 卡 ...
Страница 103: ...尺寸图 M50 SERIES 95 190 64 71 5 142 152 6 209 176 48 171 142 76 33 199 13 58 58 4x 4 5 12 5 4 5 M50 H 单位 mm ...
Страница 147: ...Product Installation M50 SERIES 17 Figure 3 Left right transverse ventilation Figure 4 Upward ventilation ...
Страница 170: ...BIOS Setup 40 M50 SERIES Advanced Super IO Configuration ...
Страница 193: ...BIOS Setup M50 SERIES 63 Advanced Super IO Configuration This item provides COM ports COM1 4 of this platform ...
Страница 205: ...BIOS Setup M50 SERIES 75 PCH IO Configuration This option provides function configuration of Intel PCH chip ...
Страница 207: ...BIOS Setup M50 SERIES 77 HD Audio Configuration This option provides configuration related to audio card Security ...