Cerabar M PMC51, PMP51, PMP55
XA02712P-A
Hauser
9
Temperature
tables
• The specified surface temperature takes into account all direct
heat influences from process heat and self-heating at the
enclosure.
• Surface temperatures at the process side maybe higher and
must be considered by the user (e.g. at high temperature process
connections).
• The T-marking is based on the process temperature of the
compact designs.
• The specified ambient and process temperature ranges
exclusively refer to the explosion protection and must not be
exceeded. Operationally permitted ambient temperature ranges
can be restricted depending on the version: See Operating
Instructions.
• Do not exceed the max. ambient temperature at the enclosure.
Device type PMC51, PMP51
The process temperatures refer to the temperature at the
separation membrane.
Device type PMP55
Higher temperatures are permitted depending on the type of
diaphragm seal.
Device type PMC51
Maximum surface
temperature
Process temperature range Ambient temperature range
T125 °C
–40 °C ≤ T
p
≤ +80 °C
–40 °C ≤ T
a
≤ +60 °C
–40 °C ≤ T
p
≤ +100 °C
–40 °C ≤ T
a
≤ +55 °C
–40 °C ≤ T
p
≤ +125 °C
–40 °C ≤ T
a
≤ +45 °C
Specific conditions of use:
The surface temperature is
• for equipment protection level (EPL) Da: T
200
125 °C (with 200 mm
dust deposit)
• and equipment protection level (EPL) Db: T
L
125 °C (with dust
accumulation T
L
)
T
L
marking:
The assigned surface temperature without dust layer is the same.
Содержание Cerabar M PMC51? Cerabar M PMP51
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