Chengdu Ebyte Electronic Technology Co.,Ltd
E79-900DM2005S User Manual
Copyright ©2012–2019
，
Chengdu Ebyte Electronic Technology Co.,Ltd
11
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER (Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Production Guidance
7.1 Reflow Soldering Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
Min preheating temp.
100
℃
150
℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temp.
183
℃
217
℃
Time(tL)Maintained Above(TL)
Time below liquid phase
line
60-90 sec
30-90 sec
Peak temperature(Tp)
Peak temp.
220-235
℃
230-250
℃
Average ramp-down rate(Tp to Tsmax)
Average ramp-down rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time to peak temperature
for 25
℃
6 minutes max
8 minutes max
