Ebyte E72-2G4M02S2B, Руководство пользователя

Страница: 18 / 21

Chengdu Ebyte Electronic Technology Co., Ltd. E72-2G4M02S2B User Manual
Copyright ©2012–2020
，
Chengdu Ebyte Electronic Technology Co., Ltd
17

It is recommended to use the Code Composer Studio (CCS) Integrated Development Environment (IDE).
8 FAQ
8.1 Communication range is too short

The communication distance will be affected when obstacle exists;

Data lose rate will be affected by temperature, humidity and co-channel interference;

The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;

Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);

The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the
lower the transmitting power;

Due to antenna quality or poor matching between antenna and module.
8.2 Module is easy to damage

Please check the power supply source, ensure it is between the recommended supply voltage, voltage higher than
the maximum will damage the module.

Please check the stability of power source, the voltage cannot fluctuate too much.

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.

Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.
8.3 BER(Bit Error Rate) is high

here are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable;

The extension line and feeder quality are poor or too long, so the bit error rate is high.
9 Production guidance
9.1 Reflow soldering temperature
Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min preheating temp. 100℃ 150℃
Preheat temperature max (Tsmax) Max preheating temp. 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second max