Chengdu Ebyte Electronic Technology Co,;Ltd
E70-900T30Suser manual
Copyright ©2012–2021
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Chengdu Ebyte Electronic Technology Co,;Ltd
24
12.Production guidance
12.1 Reflow soldering temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time
(
tL
)
Maintained Above
(
TL
)
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
220-235℃
230-250℃
Average ramp-down rate
(
Tp to Tsmax
)
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
12.2 Reflow soldering curve