Chengdu Ebyte Electronic Technology Co,;Ltd
E32-915T30S user manual
Copyright ©2012–2019
,
Chengdu Ebyte Electronic Technology Co.,Ltd.
18
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
Min preheating temp.
100
℃
150
℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temp.
183
℃
217
℃
Time
(
tL
)
Maintained Above
(
TL
)
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
Peak temp.
220-235
℃
230-250
℃
Aveage ramp-down rate
(
Tp to Tsmax
)
Aveage ramp-down rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time to peak temperature for
25
℃
max 6 minutes
max 8 minutes
10.2 Reflow soldering curve
11 E32 series
Model No.
Core IC
Frequency
Hz
Tx
power
dBm
Distance
km
Data Rate
Package
Size
mm
Interface
SX1276
868M
20
3
0.3k~19.2k
SMD
16 * 26
UART
SX1276
915M
20
3
0.3k~19.2k
SMD
16 * 26
UART