Ebyte E29-T Series, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd. E29-400TXXX product data sheet
Copyright ©2012–2023
，
Chengdu Ebyte Electronic Technology Co.,Ltd. 27
Chapter 13 Welding Work Instructions
13.1 Reflow soldering temperature
Reflow Soldering Profile Characteristics
Sn-Pb Assembly Pb-Free Assembly
Preheat/keep
warm
Min. Temperature
（ Tsmin ）
100℃ 150℃
Max. Temperature
（
T
smax
）
150℃ 200℃
Time
（
T
smin
~T
smin ）
60-120s 60-120s
Average ramp-up rate （
T
L
~T
p
）
3℃/s, Maximum 3℃/s, Maximum
Liquidous Temperature
（
T
L
）
183℃ 217℃
Time
（
tL
）
Maintained Above
60~90s 60~90s
Package peak temperature T
p
Should not exceed the
temperature indicated on the
product's label of "Moisture
Sensitivity". Should not exceed the
temperature indicated on the
product's label of "Moisture
Sensitivity".
The time (Tp) within 5°C of the specified
classification temperature (Tc), see the
figure below
20s 30s
Aveage ramp-down rate
（
T p ~T
L
）
6℃/s, Maximum 6℃/s, Maximum
Time from 25
℃
to peak temperature 6min
，
Maximum 8min
，
Maximum
※The peak temperature (Tp) tolerance definition of the temperature profile is an upper limit for the user