Chengdu Ebyte Electronic Technology Co., Ltd. E22-400T30S User manual
Copyright ©2012–
2018
,
Chengdu Ebyte Electronic Technology Co.,Ltd.
22
⚫
Please check the stability of power source, the voltage cannot fluctuate too much.
⚫
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
⚫
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
⚫
Please avoid using modules under too high or too low temperature.
11.3 BER(Bit Error Rate) is high
⚫
There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
⚫
Poor power supply may cause messy code. Make sure that the power supply is reliable.
⚫
The extension line and feeder quality are poor or too long, so the bit error rate is high;
12 Production guidance
12.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
Min preheating temp.
100
℃
150
℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temp.
183
℃
217
℃
Time
(
tL
)
Maintained Above
(
TL
)
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
Peak temp.
220-235
℃
230-250
℃
Aveage ramp-down rate
(
Tp to Tsmax
)
Aveage ramp-down rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time to peak temperature for
25
℃
max 6 minutes
max 8 minutes