Ebyte E104-BT11, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd E104-BT11 User Manual
Copyright ©2012–2020
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Chengdu Ebyte Electronic Technology Co., Ltd
6
4 Basic operation
4.1 Hardware design

It is recommended to use a DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as
small as possible, and the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply, such as reverse connection
may cause permanent damage to the module;

Please check the power supply to ensure that it is between the recommended power supply voltage, if exceeding the maximum
value will cause permanent damage to the module;

Please check the power supply stability, the voltage cannot fluctuate significantly and frequently;

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so
that the whole machine is conducive to long-term stable work;

The module should be as far away as possible from the parts with large electromagnetic interference such as power supplies,
transformers, and high-frequency wiring;

High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is
absolutely necessary to pass under the module, it is assumed that the module is soldered to the top layer, and copper is laid on the
top layer of the module contact part (all copper And well grounded), must be close to the digital part of the module and the
wiring is on the Bottom Layer;

Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route on the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the
performance of the module. It is recommended to stay away from the module according to the intensity of the interference. If the
situation permits, proper isolation and shielding can be done;

It is assumed that there are traces with high electromagnetic interference around the module (high-frequency digital,
high-frequency analog, and power traces) that will greatly affect the performance of the module. It is recommended to stay away
from the module according to the intensity of the interference. Isolation and shielding;

As far as possible away from some physical layer is also 2.4GHz TTL protocol, for example: USB3.0;

The module must not be installed inside the metal shell, which will greatly reduce the transmission distance.