Chengdu Ebyte Electronic Technology Co., Ltd.
E103-W05B User Manual
Copyright ©2012–2018
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Chengdu Ebyte Electronic Technology Co., Ltd
9
GND
P
Ground wire, connected to the power reference ground
10
NC
IO
Floating, GPIO6 of the internal chip can be used as input and output
pins
11
NC
IO
Floating, GPIO7 of the internal chip can be used as an input and output
pin
12
NC
IO
Floating, GPIO8 of the internal chip can be used as input and output
pins
13
NC
IO
Floating, GPIO9 of the internal chip can be used as input and output
pins
14
NC
IO
Floating, GPIO10 of the internal chip can be used as input and output
pins
15
RXD
I
Serial port receiving pin, support AT command
16
TXD
O
Serial port sending pin, support AT command
Note: I:input; O:output; P:power supply
Chapter 4 Basic Operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply to supply power to the module. The power supply ripple
coefficient is as small as possible, and the module needs to be grounded reliably;
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the
maximum value, it will cause permanent damage to the module;
Please check the stability of the power supply, and the voltage should not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, and the whole machine is conducive to long-term stable operation;
The module should be as far away as possible from the power supply, transformer, high-frequency wiring and other
parts with large electromagnetic interference;
High-frequency digital wiring, high-frequency analog wiring, and power wiring must avoid the bottom of the
module. If it is necessary to pass under the module, assume that the module is soldered to the Top Layer, and the top
layer of the contact part of the module is covered with copper (all copper And well grounded), it must be close to
the digital part of the module and routed in the Bottom Layer;
Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route the wires on
