Ebyte E10-433MS, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MS User Manual
Copyright ©2012–2021
，
Chengdu Ebyte Electronic Technology Co.,Ltd.
6
No. Name Direction Function
1 GND Ground
2 VCC
Power supply
：
1.8~ 3.6 V DC, 3.3V is recommended
3 GPIO0 output
GPIO
（
see more from SI4438 datasheet
）

4 GPIO1 output
GPIO
（
see more from SI4438 datasheet
）

5 IRQ output SPI interrupt request
6 SCK input Serial Clock Input
7 MISO output SPI master output slave input
8 MOSI input SPI master input slave output
9 nSEL input SPI Chip select for starting SPI communication
10 SDN
Shutdown Input Pin. It is low level when working
(See SI4438 manual for more details)
11 ANT Antenna
12 GND Ground
4. Basic operation
4.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded.
；

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module
；

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged
；

Please check the stability of the power supply, the voltage can not be fluctuated frequently
；

When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation.
；

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.
；

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer
；

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees
；

It is assumed that there are devices with large electromagnetic interference around the module that will greatly