Saturn User Manual V1
Page 41
15 THERMAL SOLUTION
Saturn integrates a heat spreader mounted on the bottom side of the board. The heat spreader is intended for
installation onto a metal enclosure surface to aid in conducting heat away from the processor and dissipating it
through the enclosure body. This method provides more efficient and greater capacity cooling than a traditional
heat sink which relies on convection cooling by transmitting heat to the much less dense air.
The mechanical drawing of the heat spreader is shown below. The heat spreader supports mounting with either
internal or external fasteners. The internal mounting holes will support up to #6 or M3 size screws. External mounting
points have separate tapped blind holes for both #6 and M3 screws. Maximum ingress of the screws into the heat
spreader is 5mm / .197
”. The tapped holes are blind to prevent screws from driving into the circuit board and
damaging it.
The outer surface of the heat spreader contains thermal pads with protective films. These films must be removed
prior to installation in order to maximize thermal contact between the heat spreader and the enclosure.
Heat spreader outer surface; remove films from
thermal pads before installation
Heat spreader inner surface
Mechanical Drawing of Heat Spreader
