Saturn User Manual V1.01
Page 14
3.3 Rugged Design
Saturn is designed from the ground up with a comprehensive set of features to meet the challenges of rugged
environments and applications:
Memory is soldered down to avoid problems that can occur with commercial style SODIMM type
memory modules
The 50% thicker PCB increases rigidity and improves reliability of fine pitch and high-ball-count BGA
solder joints
All I/O connectors are latching for increased ruggedness
A bottom-side heat spreader provides more efficient cooling than a traditional heat sink. Processor and
memory chips are both thermally connected to the heat spreader. In addition, the exterior surface
features recessed thermal pads for improved thermal connectivity to the system enclosure.
All components are rated and/or tested to ensure reliable -40 to +85ºC operation
