6
Chapter 1
INTRODUCTION
User's Manual |
PR610-C621
Chapter 1 - Introduction
X
Specifications
SYSTEM
Processor
1st / 2nd Generation Intel
®
Xeon
®
Scalable Processor Family,
LGA 3647 Socket, TDP up to 165W
Chipset
Intel
®
C621 Chipset
Memory
Six 288-pin RDIMM up to 192GB
Single Channel DDR4 up to 2933 MHZ
BIOS
Insyde SPI 128Mbit
GRAPHICS
Display
1 x VGA (only with SEM2500/SEM2510)
Single Dis-
plays
VGA (only with SEM2500/SEM2510)
EXPANSION
Interface
2 x PCIe x16 (Gen 3)
2 x PCIe x8 (Gen 3)
1 x PCI
1 x DDR4 SO-DIMM for SEM2500/2510 (opt.)
1 x M.2 M key 2280 (SATA/PCIe Gen3 x4 NVMe)
AUDIO
Audio Codec
ALC887
ETHERNET
Controller
2 x Intel
®
I210AT PCIe (10/100/1000Mbps)
IPMI: 1 x RTL8211F (only with SEM2500)
REAR I/O
Ethernet
2 x GbE (RJ-45)
1 x dedicated IPMI LAN (only with SEM2500)
USB
4x USB 3.1 Gen1
2x USB 2.0 stack
Display
1 x VGA (only with SEM2500/SEM2510)
Serial
2 x RS-232 (DB-9)
INTERNAL I/O
USB
2x USB 2.0 header (2x USB 2.0)
1x USB 2.0 vertical Type A
1x USB 3.1 Gen1 header (2x USB 3.1 gen1)
SATA
6 x SATA 3 (up to 6Gb/s)
SMBus
1 x SMBus
WATCHDOG
TIMER
Output &
Interval
System Reset, Programmable via Software from 1 to 255 sec/
Min
SECURITY
TPM
TPM 2.0 (opt.)
POWER
Type
ATX
Connector
8-pin ATX 12V power
24-pin ATX power
RTC Battery
CR2032 Coin Cell
OS SUPPORT
Windows 10 IoT Enterprise LTSB RS5(64-bit)
Windows Server 2012R2
Windows Server 2016
Linux
ENVIRON-
MENT
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH, Non-condensing
Storage: 5 to 90% RH, Non-condensing
MECHANICAL
Dimensions
ATX Form Factor: 305mm (12") x 244mm (9.6")
COOLER
Heatsink
Narrow ILM LGA 3647 (optional)
The specifications listed here may be based on editions that do not
resemble your actual products. Please visit the download page at
, or via the QR code to the right for the latest datasheet.