56
Installing and removing sled components
ThesystemsupportsFlexible MemoryConfiguration, enablingthesystemtobe configuredandruninanyvalidchipsetarchitectural
configuration. The following are the recommended guidelines for installing memory modules:
• x4 and x8 DRAM based memory modules can be mixed. For more information, see the Mode-specific guidelines section.
• Up to three dual- or single-rank RDIMMs can bepopulated per channel.
• If memorymodules with different speeds areinstalled, they will operate at thespeedoftheslowestinstalledmemorymodule(s) or
slower depending on system DIMM configuration.
• Populate memory module sockets only if a processor is installed. For single-processor systems, sockets A1 to A4 are available. For dual-
processor systems, sockets A1 to A4 and sockets B1 to B4 are available.
• Populate all the sockets with white release tabs first, followed bytheblackreleasetabs, andthenthegreenreleasetabs.
• When mixing memory modules with different capacities, populate the sockets with memory modules with highest capacity first. For
example, if you want to mix 4 GB and 8 GB memory modules, populate 8 GB memory modules in the sockets with white release tabs
and 4 GBmemorymodules in the sockets with black release tabs.
• Inadual-processorconfiguration,thememoryconfigurationforeachprocessorshouldbeidentical.Forexample,ifyoupopulatesocket
A1forprocessor1,thenpopulatesocketB1for processor 2,andsoon.
• Memorymodules of different capacities can bemixed provided other memory population rules are followed (forexample, 4 GB and 8
GB memory modules can be mixed).
• The memory module for DIMM sockets A3, A4, B3, and B4 need to be inserted 180° reverse with regard to the DIMMs in the sockets
A1, A2, B1, and B2.
• Mixing of more than two memory module capacities inasystem isnot supported.
• Populatefourmemorymodulesperprocessor(oneDIMMperchannel) atatimetomaximizeperformance.
Table 24. Heat sink—processor configurations
Watts)
Number of DIMMs
Related links
Mode-specific guidelines
Mode-specific guidelines
Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode selected.
Advanced Error Correction Code (lockstep)
Advanced Error Correction Code (ECC) mode extends SDDC from x4 DRAM based DIMMs toboth x4 and x8 DRAMs. This protects
against single DRAM chip failures during normal operation.
The installation guidelines for memory modules are as follows:
• Memory modules must be identical in size, speed, and technology.
• DIMMs installedin memorysockets with white release levers must be identical and the same rule applies for sockets with black release
levers. This ensures that identical DIMMs areinstalledin matched pair —for example, A1 with A2, A3 with A4, A5 with A6, and so on.
• DIMMsinstalledinmemorysockets with whitereleasetabsmust beidenticalandsimilarrule appliesforsockets with blackrelease
tabs. This ensures that identical DIMMsareinstalledinmatched pairs- for example, A1 with A2, A3 with A4 andsoon.
Processor configuration
Processor type (in
Heatsinkwidth
Maximum system
capacity
Reliability, Availability,
and Serviceability (RAS)
features
Dual processor
Up to 120 W
61 mm
8
8
140 W
96 mm
Single processor
120 W
61 mm
4
4
4
4
