Dell Dimension V333, Руководство по обслуживанию

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System Overview 1-1
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The Dell Dimension
®
V
xxx and Vxxxc systems are high-speed computer sys-
tems that use an Intel
®
Pentium
®
II microprocessor with MMX
™
technology or
a Celeron
™
processor with MMX technology. These Dell
®
systems combine
Peripheral Component Interconnect (PCI) design with an accelerated graphics
port (AGP) and Industry Standard Architecture (ISA) design that allows a wide
range of initial configurations and upgrade possibilities.
The Dell Dimension Vxxx and Vxxxc systems are available in either a desktop
or a mini tower configuration. Both configurations use the same base chassis.
The only difference, other than physical mounting, is the number of externally
accessible 3.5-inch drive bays.
The front of the computer has two 5.25-inch drive bays and one 3.5-inch
diskette-drive bay. In addition, the mini tower systems have two 3.5-inch drive
bays and the desktop system has one 3.5-inch drive bay. The 5.25- and 3.5-inch
drive bays can hold diskette drives, tape drives, or CD-ROM drives.
The microprocessors for each of these computers and their operating frequen-
cies are as follows:
‡
Dell Dimension V333c systems — 333-megahertz (MHz) Celeron micropro-
cessor with MMX technology that runs at an external speed of 66 MHz
‡
Dell Dimension V333 systems — 333-MHz Pentium II microprocessor with
MMX technology that runs at an external speed of 66 MHz
‡
Dell Dimension V350 systems — 350-MHz Pentium II microprocessor with
MMX technology that runs at an external speed of 100 MHz
‡
Dell Dimension V400 systems — 400-MHz Pentium II microprocessor with
MMX technology that runs at an external speed of 100 MHz
NOTE: Not all processor speeds are available at all locations.
For Dell Dimension V xxx systems, a single-edge contact (SEC) cartridge con-
nected to the system board contains the system’s microprocessor and cache
circuitry. For Dell Dimension V
xxxc systems, a single-edge processor package
(SEPP) connected to the system board contains the system’s microprocessor
and cache circuitry.
Main memory consists of up to three dual in-line memory modules (DIMMs).
The base configuration for main memory is one 32-megabyte (MB) DIMM.
Main memory can be expanded up to 384 MB by using 32-, 64-, or
128-MB DIMMs.