Dell EMC PowerEdge R740, Инструкция по установке и обслуживанию

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System Front backplane CPU Thermal
Design Power
(TDP)
CPU heat sink Fan type GPU Ambient
restriction
16 x 2.5 inch SAS/
SATA 150 W/8 core, 165
W/12 core, 200
W, 205 W 1U high
performance High performance
fan ≥1 double-width/
single-width 30°C
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If
the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to
rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 35. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a
95% upper confidence limit.
NOTE: The ISO Class 8 condition applies to data center
environments only. This air filtration requirement does not apply to
IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive
particles.
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
• Air must be free of corrosive dust.
• Residual dust present in the air must have a deliquescent point less than
60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.
Table 36. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
42 Technical specifications