12048321 Rev. 01 (Draft)
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7.4. Mounting Concept
Figure 51 Mounting Concept
7.5. EMI and ESD-Shielding
The eDM-CB-SM-IPCS will be mounted on to a metal plate used as sink for electromagnetic interferences and unwanted
charges.
The metal plate is connected as follows with the PCB.
mechanical
A
PCB ↔ mounting plate:
Carrier-Board mounting-holes with 8,4 mm pad and 3,2 mm drill diameter
according to Mini-ITX specification Figure 3
B
SMARC module
↔ PCB ↔ mounting plate:
SMARC module mounting-holes with 6,0 mm pad and 3,7 mm drill diameter to
hold solder-in threaded M2.5 standoffs
C
PCB only, no connection at mounting plate:
M.2 card-mounting positions with 7,4 mm pad and 4,4 mm drill diameter to hold
solder-in threaded M3 standoffs
electrical
A
Connect through a 100nF capacitor to PCB digital ground
Direct connect to PCB chassis ground
Direct connect to mounting plate through metal standoffs
B
Connect through zero ohm resistor to PCB digital ground
No connection at mounting plate
C
Direct connect to PCB digital ground
No connection at mounting plate
Expect direct connection to M.2-card digital GND or unconnected contact area at
M.2-card
Table 2 Mounting Points Description
Any shield or housing of a connector is directly connected to the PCB chassis ground.
Each interface connected to a cable connector is optionally protected against EMI with mating common mode chokes or
ferrite beads, which could be stuffed if necessary.
Each external interface is protected against ESD via specific diodes.
For further discharge the eDM-CB-SM-IPCS chassis-GND nets are electrically connected through the mounting plate and
metal standoffs to the PE (earth) contact of the building mains supply.
