Cypress EZ-BT WICED CYBT-343026-01, Начало работы

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Getting Started with EZ-BT WICED Modules
www.cypress.com
Document Number: 002-23400 Rev. ** 54
9 Manufacturing with EZ-BT WICED Modules
EZ-BT WICED Modules are intended to be used with traditional Surface Mount Technology (SMT) manufacturing lines
and are compatible with industry-standard reflow profiles for Pb-free solders.
9.1 SMT Manufacturing Pick-and-Place
The modules should be picked up from the topside of the module using industry-standard pick-and-place machinery
and nozzles. The ideal location for picking up the module is on the shield area of the module. For the optimal location
for your EZ-BT W
ICED Module, see the module’s datasheet.
Each module MPN has a unique center-of-
mass detailed in each product’s datasheet. This center-of-mass is the area
that represents the optimal location to pick up the unit with the nozzle. Using the center-of-mass guidelines for the pick-
and-place location minimizes SMT line disturbances caused by units releasing prematurely from the nozzle.
Figure 36 shows an image of a nozzle used by Cypress for manufacturing the CYBT-343026-EVAL Evaluation Board
product. See the center-of-
mass dimensions in each module’s datasheet to select an appropriate nozzle for your
manufacturing line equipment.
Figure 36. Nozzle Used by Cypress for Evaluation Board Production
Figure 37 shows an image of a Cypress EZ-BT Module being picked up at the center-of-mass by the nozzle referenced
above.
Figure 37. Image of Nozzle Used by Cypress for Evaluation Board Production
9.2 Manufacturing Solder Reflow
EZ-BT WICED Modules are compatible with industry-standard reflow profiles for Pb-free solder. Table 6 details the
solder reflow specifications for all modules.
Table 6. EZ-BT WICED Module Solder Reflow Specification
Module Package Maximum Peak Temperature Time at Maximum Temperature
All Packages 260
o
C 30 seconds