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CY62128EV30

MoBL® 1 Mbit (128K x 8) Static RAM

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05579 Rev. *D

 Revised March 28, 2008

Features

Very high speed: 45 ns

Temperature ranges:
• Industrial: –40°C to +85°C
• Automotive-A: –40°C to +85°C
• Automotive-E: –40°C to +125°C

Wide voltage range: 2.20V – 3.60V

Pin compatible with CY62128DV30

Ultra low standby power

Typical standby current: 1 

μ

A

Maximum standby current: 4 

μ

A

Ultra low active power

Typical active current: 1.3 mA @ f = 1 MHz

Easy memory expansion with CE

1

, CE

2

 and OE features

Automatic power down when deselected

CMOS for optimum speed and power

Offered in Pb-free 32-pin SOIC, 32-pin TSOP I, and 32-pin 
STSOP packages

Functional Description

The CY62128EV30

[1]

 is a high performance CMOS static RAM

module organized as 128K words by 8 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life™ (MoBL

®

) in portable

applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption when addresses are not toggling. Placing the
device into standby mode reduces power consumption by more
than 99% when deselected (CE

1

 HIGH or CE

2

 LOW). The eight

input and output pins (IO

0

 through IO

7

) are placed in a high

impedance state when the device is deselected (CE

HIGH or

CE

2

 LOW), the outputs are disabled (OE HIGH), or a write

operation is in progress (CE

LOW and CE

2

 HIGH and WE

LOW).

To write to the device, take Chip Enable (CE

LOW and CE

2

HIGH) and Write Enable (WE) inputs LOW. Data on the eight IO
pins is then written into the location specified on the Address pin
(A

0

 through A

16

).

To read from the device, take Chip Enable (CE

LOW and CE

2

HIGH) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins appear on the IO pins.

 

A0

IO0

IO7

IO1
IO2
IO3
IO4
IO5
IO6

A1

A2

A3

A4

A5

A6

A7

A8

A9

A

12

SENSE AMPS

POWER

 DOWN

WE

OE

A

13

A

14

A

15

A

16

ROW DECODER

COLUMN DECODER

128K x 8

ARRAY

INPUT BUFFER

A10

A11

CE1

CE2

Logic Block Diagram

Note

1. For best practice recommendations, refer to the Cypress application note 

“System Design Guidelines”

 at 

http://www.cypress.com.

[+] Feedback 

Содержание CY62128EV30

Страница 1: ...an automatic power down feature that significantly reduces power consumption when addresses are not toggling Placing the device into standby mode reduces power consumption by more than 99 when deselected CE1 HIGH or CE2 LOW The eight input and output pins IO0 through IO7 are placed in a high impedance state when the device is deselected CE1 HIGH or CE2 LOW the outputs are disabled OE HIGH or a wri...

Страница 2: ...10 IO3 A1 A0 A3 A2 1 2 3 4 5 6 7 8 9 10 11 14 19 20 24 23 22 21 25 28 27 26 Top View SOIC 12 13 29 32 31 30 16 15 17 18 GND A16 A14 A12 A7 A6 A5 A4 A3 WE VCC A15 A13 A8 A9 IO 7 IO 6 IO 5 IO 4 A2 NC IO 0 IO 1 IO 2 CE1 OE A10 IO 3 A1 A0 A11 CE2 Table 1 Product Portfolio Product Range VCC Range V Speed ns Power Dissipation Operating ICC mA Standby ISB2 µA f 1 MHz f fmax Min Typ 3 Max Typ 3 Max Typ 3 ...

Страница 3: ...IOL 0 1 mA 0 4 0 4 V IOL 2 1 mA VCC 2 70V 0 4 0 4 V VIH Input HIGH Voltage VCC 2 2V to 2 7V 1 8 VCC 0 3V 1 8 VCC 0 3V V VCC 2 7V to 3 6V 2 2 VCC 0 3V 2 2 VCC 0 3V V VIL Input LOW Voltage VCC 2 2V to 2 7V 0 3 0 6 0 3 0 6 V VCC 2 7V to 3 6V 0 3 0 8 0 3 0 8 V IIX Input Leakage Current GND VI VCC 1 1 4 4 μA IOZ Output Leakage Current GND VO VCC Output Disabled 1 1 4 4 μA ICC VCC Operating Supply Curre...

Страница 4: ...4 5 inch two layer printed circuit board 33 01 48 67 32 56 C W ΘJC Thermal Resistance Junction to Case 3 42 25 86 3 59 C W Figure 1 AC Test Loads and Waveforms VCC VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90 10 90 10 Rise Time 1 V ns Fall Time 1 V ns OUTPUT V Equivalent to THEVENIN EQUIVALENT ALL INPUT PULSES RTH R1 Parameters 2 50V 3 0V Unit R1 16667 1103 Ω R2 15385 1554 Ω RTH 8000 645 Ω V...

Страница 5: ...E LOW to High Z 12 13 18 20 ns tLZWE WE HIGH to Low Z 12 10 10 ns VCC min VCC min tCDR VDR 1 5V DATA RETENTION MODE tR VCC CE Notes 10 CE is the logical combination of CE1 and CE2 When CE1 is LOW and CE2 is HIGH CE is LOW when CE1 is HIGH or CE2 is LOW CE is HIGH 11 Test Conditions for all parameters other than tri state parameters assume signal transition time of 3 ns or less 1 V ns timing refere...

Страница 6: ...ZCE tPD IMPEDANCE ICC ISB HIGH ADDRESS CE DATA OUT VCC SUPPLY CURRENT OE DATA VALID tHD tSD tPWE tSA tHA tAW tSCE tWC tHZOE ADDRESS CE WE DATA IO OE NOTE 20 Notes 15 The device is continuously selected OE CE1 VIL CE2 VIH 16 WE is HIGH for read cycle 17 Address valid before or similar to CE1 transition LOW and CE2 transition HIGH 18 Data IO is high impedance if OE VIH 19 If CE1 goes HIGH or CE2 goe...

Страница 7: ...tPWE tHA tHD tSD tSCE ADDRESS CE DATA IO WE DATA VALID tHD tSD tLZWE tPWE tSA tHA tAW tSCE tWC tHZWE ADDRESS CE WE DATA IO NOTE 20 Table 2 Truth Table for CY62128EV30 CE1 CE2 WE OE Inputs Outputs Mode Power H X X X High Z Deselect Power Down Standby ISB X L X X High Z Deselect Power Down Standby ISB L H H L Data Out Read Active ICC L H H H High Z Output Disabled Active ICC L H L X Data in Write Ac...

Страница 8: ...pin TSOP Type I Pb free Automotive A 55 CY62128EV30LL 55ZXE 51 85056 32 pin TSOP Type I Pb free Automotive E Contact your local Cypress sales representative for availability of these parts Package Diagrams Figure 7 32 Pin 450 Mil Molded SOIC 51 85081 0 546 13 868 0 440 11 176 0 101 2 565 0 050 1 270 0 014 0 355 0 118 2 997 0 004 0 102 0 047 1 193 0 006 0 152 0 023 0 584 0 793 20 142 0 450 11 430 0...

Страница 9: ...CY62128EV30 Document 38 05579 Rev D Page 9 of 11 Figure 8 32 Pin Thin Small Outline Package Type I 8 x 20 mm 51 85056 Package Diagrams continued 51 85056 D Feedback ...

Страница 10: ...CY62128EV30 Document 38 05579 Rev D Page 10 of 11 Figure 9 32 Pin Shrunk Thin Small Outline Package 8 x 13 4 mm 51 85094 Package Diagrams continued 51 85094 D Feedback ...

Страница 11: ... Code except as specified above is prohibited without the express written permission of Cypress Disclaimer CYPRESS MAKES NO WARRANTY OF ANY KIND EXPRESS OR IMPLIED WITH REGARD TO THIS MATERIAL INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE Cypress reserves the right to make changes without further notice to the materials described herein...

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