CapSense Technology
AN64846 - Getting Started with CapSense
®
Doc. No. 001-64846 Rev. *X
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2.7 Sensor Construction
A capacitive sensor can be constructed using different materials depending on the application requirement. In a typical
sensor construction, a conductive pad or surface that senses the user touches is connected to the pin of the capacitive
controller using a conductive trace or link. This whole arrangement is placed below a non-conductive overlay material
and the user interacts on top of the overlay. A very common method of sensor construction is to etch copper pads and
traces on a FR4 PCB. However, in touchscreen applications, Indium Tin Oxide (ITO) is used to construct transparent
sensors. This section presents various methods of constructing a sensor and the features of each method so that you
can choose one that fits your requirements.
2.7.1 Field-Coupled Via Copper Trace (PCB)
Figure 2-29. Field Coupled Using PCB
Features of a PCB-based design:
Most common implementation
Copper pads etched on the surface of the PCB act as sensor pads
Electric field emanates from the copper sensor pad to ground plane
No mechanical moving parts
A nonconductive overlay serves as the touch surface for the button
Ideal topology for simple flat panel designs
Low BOM cost
2.7.2 Field Coupled Via Spring/Gasket/Foam
Figure 2-30. Field Coupled Via Spring
Features of a design based on springs/gaskets/foam:
Electrical field coupled from PCB to overlay using a compressed spring, or conductive gasket or foam (Closed-cell
conductive foam should be used. Materials that absorb moisture should be avoided.)
Conductive material itself acts as capacitive sensor pad
No mechanical moving parts. Springs and foam do not move
Any non-conductive overlay serves as the button touch surface