Operational Overview
Doc.#6000-0015 Rev: A
Page 21
Optional Battery Pack
(PS100)
DC-DC
Converter
Baseband
Controller
Bluetooth
Radio
Chip
Radio Module
DC Power
Module
Sensor
Sensor
Sensor
Sensor
SI/O
5 VDC
Supply
SI/O
Serial
Comm
A/D
16-bit
Mux
Temp Sensor
SRAM
for
Data
ARM7
uP
Flash
RAM
CN1000 Node
External
DC Power
(PS200 or
PS300)
Optional
RF
Power
Amp
Antenna
Figure 16. CrossNet Node Internal Architecture
Smart I/O (SIO)
The CrossNet architecture is specifically designed to support a broad range
of sensor types. The sensor is connected to the SIO, which contains the
sensing element, signal-conditioning circuitry including calibration and
temperature compensation, and the IEEE 1451.2 TEDS (Transducer
Electronic Data Sheet. These features can either be built directly into the
sensor or included in a CrossNet Smart I/O (SIO) sensor-interface cable that
contains the required circuitry (microcontroller for Node communications
plus memory for TEDS configuration information). CrossNet cables are
available for sensors with voltage, current, RTD, thermocouples, or
resistive bridge outputs. Specialized CrossNet cables can easily be
developed for specific sensor configurations. Also, user-defined “Sensor
Types” may be added using the procedure in Appendix B.
SIO Architecture
SIOs consist of the following:
1. An internal µP that serially communicates with the CrossNet
Node. The memory of the µP contains the following:
•
Transducer Electronic Data Sheet (TEDS). This contains all
information to identify the sensor. It includes calibration
coefficients, calibration dates, and engineering units. It also
contains manufacturer and serial number identifications.
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