soldering & handling
Copyright © 2008-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
and XLamp
®
are
registered trademarks and the Cree logo is a trademark of Cree, Inc. This document is provided for informational purposes only and is not a warranty or
a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales
at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/
or vendor endorsement, sponsorship or association.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
C
LD
-A
P
16
r
ev 1
0A
Cree
®
XLamp
®
XR Family LEDs
TabLE oF ConTEnTs
Xr Family LeDs ...........................................2
Circuit Board Preparation & Layouts ........................................3
Case Temperature (T
) Measurement Point ............................3
Xr Family LeDs .........................4
XR Family LED Reflow Soldering Characteristics
Moisture Sensitivity ..................................................................7
.....................................................8
Chemicals & Conformal Coatings
............................................8
Assembly Storage & Handling ..................................................9
Tape and reel ......................................................................... 10
Packaging and Labels............................................................ 11
inTRoDuCTion
This application note applies to XLamp
®
XR family LEDs, which
have order codes in the following format.
Xrxxxx-xx-xxxx-xxxxxx
This application note explains how XLamp XR family LEDs and
assemblies containing these LEDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp XR family LEDs.
