Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc.This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association.
6
XLamp
®
mX FamiLy LED SoLDEring & HanDLing
Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends
returning any unused LeDs to the resealable moisture-barrier bag and closing the bag immediately after use.
Humidity inside the moisture-barrier packaging can be checked immediately after opening the packaging by inspecting the humidity
indicator card. The pictures below provide a guide on how to read the humidity indicator card immediately after opening the moisture-barrier
packaging.
The humidity indicator card shows that the humidity has not
reached 10%.
The humidity indicator card shows that the humidity level has
exceeded 30%.
baking Conditions
It is not necessary to bake all XLamp MX Family LeDs. Only the LeDs that meet all of the following criteria must be baked:
1. LeDs that have been removed from the original MBB packaging.
2. LeDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LeDs that have not been soldered.
LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking.
Do not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity
section above.
storage Conditions
XLamp MX Family LeDs that have been removed from the original MBB packaging but not soldered should be stored in one of the
following ways:
•
Store the parts in a rigid metal container with a tight-fitting lid. Verify that the storage temperature is <30 °C, and place fresh desiccant
and an RH indicator in the container to verify that the RH is no greater than 60%.
•
Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater
than 60%.
•
For short-term store only: LeDs can be resealed in the original MBB bag soon after opening. Fresh desiccant may be needed. Use the
included humidity indicator card to verify <60% RH.
