Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc.This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association.
4
XLamp
®
mX FamiLy LED SoLDEring & HanDLing
CasE tEMpEraturE (t
s
) MEasurEMEnt poInt
XLamp MX LeD case temperature (Ts) should be measured on the PCB surface, as close to the LeD’s thermal pad as possible. This
measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp MX LeD itself. In testing, Cree has found such
a solder pad to have insignificant impact on the resulting Ts measurement.
notEs on soLDErIng XLaMp
®
MX FaMILy LEDs
The XLamp MX Family of LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing
the PCB on a hotplate and following the reflow soldering profile listed in the XLamp MX Family LED Reflow Soldering Characteristics
section (page 7).
Do not wave-solder XLamp MX LEDs. Do not hand-solder XLamp MX LEDs. N2 reflow is recommended.
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CorrECt
P
CorrECt
Notes on Soldering XLamp XP Family LEDs
XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or
by placing the PCB on a hotplate and following the reflow soldering profile listed on the previous page.
Do not wave solder XLamp XP Family LEDs. Do not hand solder XLamp XP Family LEDs.
Solder Paste Type
Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after
reflow soldering is not required. Cree uses the following solder paste internally:
Indium Corporation of America® Part number 82676
•
Sn62/Pb36/Ag2 composition
•
Flux: NC-SMQ92J
Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg.
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results,
an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder
thickness that results in a 3-mil (75-μm) bond line.
X
WRONG
P
CORRECT
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CORRECT
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WRONG
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CORRECT
This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the
data sheets available at www.cree.com. For warranty information, please contact Cree Sales at [email protected].
Copyright © 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo
and XLamp are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners
and do not imply specific product and/or vendor endorsement, sponsorship or association.
4
CLD-AP25 Rev 3
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com/xlamp
X
Wrong
