Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc.This
document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information,
please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement,
sponsorship or association.
3
XLamp
®
mX FamiLy LED SoLDEring & HanDLing
33
CIrCuIt boarD prEparatIon & Layouts
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
soldering XLamp MX LeDs onto the PCB.
The diagram below shows the recommended PCB solder pad layout for XLamp MX Family of LeDs.
For additional information about FR4 thermal vias, illustrated above, consult Cree’s
Optimizing PCB Thermal Performance for Cree XLamp
.
recommended Fr4 solder pad
recommended MCpCb solder pad
All dimensions in mm.
alternative solder pad
recommended stencil pattern
(Hatched area Is opening)
