XLAMP
®
MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree
®
and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp
®
is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4
7
NOTES ON SOLDERING XLAMP
®
MH FAMILY LEDS
XLamp MH Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the
PCB on a hotplate and following the reflow soldering profile listed on
Do not wave solder XLamp MH Family LEDs. Do not hand solder XLamp MH Family LEDs.
Solder Paste Type
Cree LED strongly recommends using “no clean” solder paste with XLamp MH Family LEDs so that cleaning the PCB after reflow soldering
is not required. Cree LED uses
internally.
Cree LED recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste Thickness
The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree LED has seen positive results using solder thickness that results in a
4‑mil (102‑μm) bond line, i.e., the solder joint thickness after reflow soldering.
P
CORRECT
P
CORRECT
X
WRONG
P
CORRECT
X
WRONG
