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4
Cooling Solution
The conga-IC170 SBC offers Ultra Low Power boards with high computing performance and outstanding graphics. Due to its low power
consumption, the SBC generates less heat and therefore requires less active cooling, allowing the use of quieter, lower profile coolers that are
better suited to small form factor systems.
Nonetheless, all electronics contain semiconductor devices which have operating temperature ranges that should be adhered to. For this reason,
it is imperative to provide sufficient air flow to each of the components, to ensure the specified operating temperature of the conga-IC170 is
maintained.
congatec AG offers two cooling possibilities for the conga-IC170:
•
A customized active cooling solution (fan attached with heatsink) in combination with the conga-IC170 retention frame. This cooling solution
is adapted to the Thin Mini-ITX height specification and features a Hi-Flow 225UT pressure sensitive, phase change thermal interface. The
retention frame acts as a mounting backplate and also as board reinforcement to prevent PCB deformation. Refer to section 4.2 “Active
Cooling Dimensions” for the dimensions of the active cooling solution.
•
The use of a custom cooling solution in combination with the conga-IC170 retention frame.
Note
When a passive cooling is used, the end user must ensure that adequate air flow is maintained.
See section 1.2.2 “Optional Accessories/Cables” for the part numbers of the cooling accessories.
Retention Frame
Active Cooling Solution
