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CCBU40 COMPACT CONTROLLER BOARD - PRODUCT AND WARRANTY INFORMATION
Version 1.21
XIII.
THERMAL INTERFACE
WARNING: Risk of burns
The product and especially its thermal interface can be very hot (>100°C) when operating
and after operation. There is a risk of burns when touching the packaging.
The bottom plate of the CCBu40 is the heat sinking surface. To prevent from overheating at high temperature
and/or high power, the user must implement proper heat sink for cooling. This can be done by attaching a spare
heatsink, or directly by attaching the CCBu40 on a surface providing heat dissipation.
The requirement for the heat sink efficiency depends both on the maximum ambient temperature of the
application and the CCBu40 power consumption (estimated on the Figure 9). The maximum thermal resistance
of the heat sink from the CCBu40 surface to ambient is computed using the following equation:
R
heatsink
< ((125
– T
max
) / P
CCBu40
) - 0.2
Where R
heatsink
is the thermal resistance of the heatsink in °C/W
T
max
is the maximum ambient temperature in °C (between 25°C and 70°C)
P
CCBu40
is the power consumption of the CCBu40 in W.
Based on this equation, maximum R
heatsink
can be computed in two specific cases:
•
At +70°C, depending on the power consumption, on the Figure 10.
•
At 95W, depending on the ambient temperature, on the Figure 11.
