manual-rmp210-rmp3545-en-18
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The entire sequence will take approx. 3 hours if you start at 20°C and take out the pcbs at a tem -
perature of 30°C. If you take up protective measures, you can remove the boards at higher tem-
peratures and insert a new stack. This way the press cycle reduces to approx. 45min. Gross size
of the PCBs is 250 x 350 mm (RMP 3545: 350x450mm) which corresponds to a PCB net size of
210 x300 mm (RMP 3545: 300x400mm).
The space between the heating plates is 40 mm. If you use our standard press plates and separ -
ate the 1.5 mm thick multi-layers with 1.5 mm press sheets you can make about 7 multilayers sim -
ultaneously.
Since the pressing force is generated pneumatically, it ensures that the pressure is distributed
evenly over the surface.
To register the layers of your multilayer you can use the register hole function of our software
IsoCam and the Bungard Favorit fixes the layers with rivets.
Technical Data
RMP210
RMP3545
Board size:
gross 250 x 350 mm
net approx. 210 x 300 mm
gross 450 x 350 mm
net approx.. 400 x 300 mm
Pressure:
> 12 t
> 24 t; max. ca. 30t
Compressor:
0-15 bar included in delivery
0-15 bar included in delivery
Temperature:
250 °C
250 °C
Heating up:
ca 30 min.
ca 30 min.
Pressing Time:
ca. 60 min.
ca. 60 min.
Cooling down:
ca 120 min.
ca 120 min.
Dimension:
ca 650 x 650 x 1300 mm
ca. 830 x 820 x 1600 mm
Space requirements:
700 x 1500 mm²
870 x 1500
Weight:
ca. 130 kg
ca. 350 kg
Electrical connection:
230 V 50 Hz 16 A
400V 50Hz 5000W 16 A Fuse per phase
Maximum press
stack:
Distance between heating plates: 42-43
mm, Press plates 2x10mm → ca. 22mm
Press stack height
Distance between heating plates: 38-40
mm, Press plates 2x10mm → ca. 18mm
Press stack height
Technical changes possible and reserved at any times.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: +49 (0) 2292/9 28 28 - 0, Fax: +49 (0) 2292/9 28 28 - 29, E-mail: [email protected]
