Bungard RMP 210, Руководство пользователя

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manual-rmp210-rmp3545-en-18 Page 12 / 16
Composition of Press Stack
You can press up to 4 Layers in floating technique. Add reference holes into your inner layers
and adjust your layouts according to these holes.
Reference holes can be inserted into your layout with the help of IsoCam and can be drilled
with the Bungard CCD.
Cut your prepregs and your outer layers smaller (as seen in the upper picture), so the resin of
the boards will not flow into the reference holes during the press cycle. You will need these
reference holes later on to register your pcb again for drilling on the CCD.
If your pcb is smaller than the press area of the machine (250 x 350 mm), we recommend to
adapt the pressure according to this formula:
P
A
= (P
W
x A
W
) / A
A
P
A
= desired pressure for your pcb in bar
P
W
= machine pressure RMP 210) in bar
A
W
= press area of machine (250 x 350 mm = 8.75 dm² = constant)
A
A
= press area of your pcb in dm²
Example:
If you want to press a pcb with 120 x 120 mm with a pressure of 16 bar, please adjust formula:
(P
A
x A
A
) / A
W
= P
W
(16 bar x 1,44 dm²) / 8.75 dm² = 2,63 bar
Set this pressure at the machine. For small pcbs we generally recommend to panelize the pcb
and so increase the press area.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: +49 (0) 2292/9 28 28 - 0, Fax: +49 (0) 2292/9 28 28 - 29, E-mail: support@bungard.de
Copyright by Bungard Elektronik GmbH & Co. KG
Innenlage/Inner Layer
Außen-/Innenlage
Top/Bottom-Layer
Prepreg
Referenzlöcher ohne Nieten !
Reference holes without Rivets !