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Brocade FastIron Edge X-Series Hardware Installation Guide
Part Number: 53-1002499-02
Layer 3 Upgrade Procedures for FastIron IPv4 devices
Installation overview
FIGURE 1
Top cover removal on FastIron compact switches
Installation overview
You need a Phillips-head screwdriver and an ESD wrist strap to perform this procedure. You also need a static-free work area.
Complete the following steps to perform the upgrade.
1.
Power down the device, remove it from the equipment rack (if installed in one) and place the device on a static-free work area.
Disconnect the power cord from all power sources to completely remove power from the device.
2.
Remove the top cover from the device.
3.
If you are upgrading a FESX model and the device has a 10-Gigabit Ethernet module installed, remove the faceplate from the
front of the device and unseat the 10-Gigabit module from the main board, without disconnecting the cable at the rear of the
10-Gigabit module. Refer to the section
on page 87 for details.
4.
Insert the Dual Inline Package (DIP) key provided in this upgrade kit into the DIP socket on the motherboard. The location of the
DIP socket is listed by device type in
Make sure you insert the DIP key so that lead pin 1 goes into the correct hole depending on your device. If
you accidentally insert the DIP key backwards, the device will not work and may be damaged when you
power it on.
5.
If applicable, replace the 10-Gigabit Ethernet module on top of the main board.
6.
Replace the top cover.
7.
If applicable, replace the faceplate.
8.
If applicable, reinstall the device in its rack, then power on the device.
9.
Install the full Layer 3 software. Note the precautions in
“Before installing the software”
10. Reboot the device.
Remove these screws on
b
oth sides of the device
Note: If r
a
ck mo
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nt e
a
rs
a
re inst
a
lled,
remove the fo
u
r screws from e
a
ch e
a
r.
Re
a
r
Front
Side
