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DDR3 SDRAM in Stratix III Devices Design Flow
Page 23
© November 2008
Altera Corporation
AN 436: Using DDR3 SDRAM in Stratix III and Stratix IV Devices
■
Maximum possible interface width in any particular device is limited by the
number of DQS groups available within that bank or side, see
■
Sufficient regional clock networks are available to the interface PLL to allow
implementation within the required number of quadrants
■
Sufficient spare pins exist within the chosen bank or side of the device to include
all other address and command, and clock pin placement requirements
■
The greater the number of banks, the greater the skew, hence Altera recommends
that you always generate a test project of your desired configuration and confirm
that it meets timing
Address and Command, Clock, and Other Signals
This section describes the following signals:
■
Address and command
■
Clock
■
Other signals
DDR3 SDRAM Component Additional Pins
The largest individual DDR3 SDRAM components typically available are 2GB ×8
devices. These devices usually require a maximum of 38 pins, which can be broken
down in the following way:
■
8
DQ
pins
■
1
DM
pin
■
1
DQS
pin
■
1
DQS#
pin
■
15
A[14:0]
pins
■
3
BA[2:0]
pins
■
1
CK
pin
■
1
CK#
pin
■
7
CKE
,
CS#
,
RAS#
,
CAS#
,
WE#
,
ODT
,
reset#
pins
DQ
,
DM
,
DQS
, and
DQSn
should reside in a dedicated ×8 DQS group, the remaining
27 additional signals should be placed within the same bank.
DDR3 SDRAM DIMM Additional Pins
The largest DDR3 SDRAM DIMMs typically available are 4 GB ×72 dual rank
modules. These modules usually require a maximum of 132 pins, which can be
broken down in the following way:
■
72
DQ
pins
■
9
DM[8:0]
pins
■
9
DQS[8:0]
pins
■
9
DQS#[8:0]
pins