Numbers of MPFE Ports Per Device
Table 6-15: Numbers of MPFE Command, Write-Data, and Read-Data Ports for Each Cyclone V Device
MPFE Ports
Member Code
Variant
Read-data
Write-data
Command
2
2
4
A2
Cyclone V E
2
2
4
A4
4
4
6
A5
4
4
6
A7
4
4
6
A9
2
2
4
C3
Cyclone V GX
4
4
6
C4
4
4
6
C5
4
4
6
C7
4
4
6
C9
4
4
6
D5
Cyclone V GT
4
4
6
D7
4
4
6
D9
Bonding Support
Bonding is supported only for hard memory controllers configured with one port. Do not use the
bonding configuration when there is more than one port in each hard memory controller.
Note:
You can bond two hard memory controllers to support wider data widths.
If you bond two hard memory controllers, the data going out of the controllers to the user logic is synchro-
nized. However, the data going out of the controllers to the memory is not synchronized.
The bonding controllers are not synchronized and remain independent with two separate address buses and
two independent command buses. These buses are calibrated separately.
If you require ECC support for a bonded interface, you must implement the ECC logic external to the hard
memory controllers.
A memory interface that uses the bonding feature has higher average latency. Bonding through the
core fabric will also cause a higher latency.
Note:
Altera Corporation
External Memory Interfaces in Cyclone V Devices
6-33
Numbers of MPFE Ports Per Device
CV-52006
2014.01.10