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Rockwell Automation Publication 2099-UM001D-EN-P - December 2012
Chapter 2
Install the Kinetix 7000 Drive System
Minimizing Electrical Noise
This section outlines best practices that minimize the possibility of noise-related
failures as they apply specifically to Kinetix 7000 drive installations. For more
information on the concept of high-frequency (HF) bonding, the ground plane
principle, and electrical noise reduction, see the System Design for Control of
Electrical Noise Reference Manual, publication
.
Bonding Modules
Bonding is the practice of connecting metal chassis, assemblies, frames, shields,
and enclosures to reduce the effects of electromagnetic interference (EMI).
Unless specified, most paints are not conductive and act as insulators. To achieve
a good bond between the drive and subpanel, surfaces need to be unpainted or
plated. Bonding metal surfaces creates a low-impedance return path for high-
frequency energy.
Improper bonding blocks the direct return path and routes high-frequency
energy to elsewhere in the cabinet. Excessive high-frequency energy can effect the
operation of other microprocessor controlled equipment.
The illustrations that follow show details of recommended bonding practices for
painted panels, enclosures, and mounting brackets.
IMPORTANT
To improve the bond between the drive and subpanel, construct your
subpanel out of zinc plated (unpainted) steel.
