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ZYNQ FPGA Development Board AX7350B User Manual
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Part 3: DDR3 DRAM
The AX7350B FPGA development board is equipped with four Micron
512MB DDR3 chips, model MT41J256M16HA-125 (compatible with
MT41K256M16HA-125), in which Two DDR3s are mounted on the PS and PL
sides. Two DDR3 SDRAMs form a 32-bit bus width. The PS-side DDR3
SDRAM has a maximum operating speed of 533MHz (data rate 1066Mbps),
and two DDR3 memory systems are directly connected to the memory
interface of the BANK 502 of the ZYNQ Processing System (PS). The PL-side
DDR3 SDRAM has a maximum operating speed of 800MHz (data rate
1600Mbps), and two DDR3 memory systems are connected to the BANK33
and BANK34 interfaces of the FPGA. The specific configuration of DDR3
SDRAM is shown in Table 3-1.
Bit Number
Chip Model
Capacity
Factory
U4,U5,U7,U8
MT41J256M16HA-125
256M x 16bit
Micron
Table 3-1: DDR3 SDRAM Configuration
The hardware design of DDR3 requires strict consideration of signal
integrity. We have fully considered the matching resistor/terminal resistance,
trace impedance control, and trace length control in circuit design and PCB
design to ensure high-speed and stable operation of DDR3.