
5
MIC-6311 User Manual
Chapter 1
H
ardware
C
onfiguration
1.2.14
Mechanical and Environmental Specifications
Operating temperature:
0 ~ 55°C (32 ~ 131°F) for industrial-temperature
SKUs; -40 ~ 70°C(-40 ~140°F) for wide-temperature SKUs. Please contact your
Advantech representative regarding the availability of wide-temperature SKUs.
Storage Temperature:
-40 ~ 85°C (-40 ~ 185°F)
Humidity:
95% @ 40°C (non-condensing)
Humidity (non-operating):
95% @ 60°C (non-condensing)
Vibration:
5~100Hz, 1.06Grms (without on-board 2.5” SATA HDD)
Vibration (non-operating):
5~100 Hz, 2 Grms
Shock:
20 G (without on-board 2.5” SATA HDD)
Shock (non-operating):
50 G
Altitude:
4,000 m above sea level
Board size:
233.35 x 160 mm (6U size), 1-slot (4 TE) wide
Weight:
0.8 kg (1.76 lb)
1.2.15
Compact Mechanical Design
The MIC-6311 has a specially designed CPU heatsink to enable fanless operation.
Please contact your distributor or local Advantech branch regarding the feasibility of
a customized conduction-cooling heatsink design.
1.2.16
PCIE Bridge
The MIC-6311 uses a PLX PEX8733 component and 32-lane, 18-port, PCIe Gen3
switch device as the gateway to an intelligent subsystem. When configured as a sys-
tem controller, the bridge acts as a standard transparent PCI Express to PCI/PCI-X
Bridge. The MIC-6311 receives power from the backplane and supports a rear I/O.
The PLX PEX 8733 offers the following features:
PCI Interface
–
Full compliance with the PCI Local Bus Specification, Revision 3.0
–
PCI Power Management Spec, r1.2
Supports transparent and non-transparent mode of operations.
Supports forward and reverse bridging
64-bit, 66MHz asynchronous operation
Integrated DMA engine, four DMA Channels
End-to-end CRC (ECRC) protection
Failover support, can be configured for 1+1 redundancy or N+1 redundancy
Please consult the PLX PEX 8733 data book for details.
1.2.17
I/O Connectivity
For MIC-6311, front panel I/O is provided through two RJ-45 Gigabit Ethernet ports,
one RJ-45 COM port, two USB 3.0 ports, one USB 2.0, one VGA connector, and one
XMC/PMC knockout.
The onboard I/O consists of one SATA channel, which can be connected to a daugh-
ter board for 2.5" SATA HDD and a CFast slot. Rear I/O connectivity is available via
the following VPX connectors:
Note!
The operating temperature range of the MIC-6311 depends on the pro-
cessor installed and the airflow through the chassis.
Содержание MIC-6311
Страница 1: ...User Manual MIC 6311 OpenVPX CPU Blade with Intel 4th Core Processor ...
Страница 12: ...MIC 6311 User Manual xii ...
Страница 13: ...Chapter 1 1 Hardware Configuration This chapter describes how to configure the MIC 6311 hardware ...
Страница 28: ...MIC 6311 User Manual 16 ...
Страница 29: ...Chapter 2 2 AMI BIOS Setup This chapter describes how to configure the AMI BIOS ...
Страница 50: ...MIC 6311 User Manual 38 ...
Страница 51: ...Chapter 3 3 BMC Firmware Operation This chapter describes the BMC firmware features ...
Страница 70: ...MIC 6311 User Manual 58 ...
Страница 76: ...MIC 6311 User Manual 64 ...
Страница 77: ...Appendix A A Pin Assignments ...
Страница 86: ...MIC 6311 User Manual 74 ...
Страница 87: ...Appendix B B Programming the Watchdog Timer This appendix describes how to program the watchdog timer ...
Страница 89: ...Appendix C C FPGA This appendix describes the FPGA configuration ...
Страница 91: ...Appendix D D IO Controller List ...
Страница 93: ...Appendix E E Glossary ...
Страница 96: ...MIC 6311 User Manual 84 ...
Страница 97: ...Appendix F F BIOS Checkpoint ...
Страница 104: ...MIC 6311 User Manual 92 ...
Страница 105: ...Appendix G G IPMI PICMG Command Subset Supported by BMC ...
Страница 115: ...Appendix H H Driver Tools ...
Страница 117: ...105 MIC 6311 User Manual Appendix H Driver Tools ...