Express-CFR
Specifications
7
2.17. Functional Diagram
Mobile
9
th
Gen Intel® Core™
Intel® Xeon® E
Pentium®/Celeron® G
Processor
Thermal
Sensor
TPM
2.0
Mobile Intel®
QM370/HM370/
CM246
Chipset
GPIO
GP I2C
SPI 0
BIOS
LPC bus
PCIe x16 (Gen3)
1 x16, 2 x8, or 1 x8 + 2 x4
SPI
HD Audio
4x SATA 6Gb/s
(port 0/1/2/3)
8x USB 2.0
4x USB 3.1 (port 0/1/2/3)
UART0/1
SPI 1
BIOS
DDC I2C
SODIMM 2
2133/2400 MHz
4-32 GB DDR4
2x PCIe x1 (Gen3)
(port 6/7)
SPI_CS#
DDI 1
DP/HDMI/DVI
DDI 2
DP/HDMI/DVI
DDI 3
DP/HDMI/DVI
single/dual
18/24 bit LVDS
6x PCIex1 (Gen3)
(port 0-5)
New
SEMA
BMC
PCIe x1
eDP - LVDS
LAN
I219 LM/V
No GbE_SDP
XDP
60
SMBus
4x GPO,
4x GPI
SMBus
LPC to
UART
SODIMM 1
2133/2400 MHz
4-32 GB DDR4
SODIMM 3
2133/2400 MHz
4-32 GB DDR4
SDIO (for
SD card)
MUX
GPIO
SD
eDP x2
eDP x2
AUX
eDP x4
eDP - VGA
Figure 1: Express-CFR Functional Block Diagram
Содержание COM Express Express-CFR
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