Publication No. SBC329-HRM/1
Introduction 17
1.1.3
Cooling
CAUTION
The SBC329 requires air-flow of at least 300
lfm
for build levels 1 and 2, and at least 600
lfm
for
build level 3. If a conduction-cooled (level 4 or 5) SBC329 is operating on an extender card, it
requires air-flow of at least 300
lfm
across it.
1.1.4
Handling
CAUTION
Only handle the SBC329 by the edges or front panel.
Figure 1-2 ESD Label (Present on Board Packaging)
1.1.5
Heatsink
CAUTIONS
Do not remove the heatsink. There are no user-alterable components underneath the heatsink,
so users should have no reason to remove it.
Users should not attempt reattachment of the heatsink, as this requires precise torque on the
screws attaching the heatsink to the PCB. Over-tightening the screws may cause the heatsink
to damage components beneath it.
Removal and re-attachment of the heatsink should only be
carried out by Abaco.