Texas Instruments bq51010BEVM-764, User Manual

Page: 1 / 26

User's Guide
SLUUAE3A – August 2013 – Revised December 2013
bq51010BEVM-764 Evaluation Module (WCSP Package)
The bq51010BEVM-764 (EVM) wireless power receiver evaluation kit from TI is a high-performance, easy-
to-use development kit for the design of wireless power solutions. The EVM helps designers to evaluate
the operation and performance of the bq51010B, 7-V power supply for wireless power transfer. The
bq51010B devices provide AC/DC power conversion and regulation while integrating the digital control
required to comply with the Qi-communication protocol. The kit speeds up the development of end-use
applications.
Contents
1 Considerations with this EVM
.............................................................................................
2
2 Modifications
.................................................................................................................
2
3 Recommended Operation Condition
.....................................................................................
2
4 Equipment and EVM setup
................................................................................................
3
4.1 Schematic
...........................................................................................................
3
4.2 Connector and Test Point Descriptions
.........................................................................
3
4.3 Jumpers and Switches
............................................................................................
3
4.4 Test Point Descriptions
............................................................................................
4
4.5 Pin Description of the IC
..........................................................................................
5
5 Test Procedure
..............................................................................................................
6
5.1 Definition
............................................................................................................
6
5.2 Recommended Test Equipment
.................................................................................
6
5.3 Equipment Setup
...................................................................................................
7
5.4 Procedure
...........................................................................................................
8
6 Test Results
................................................................................................................
10
6.1 Load Step
..........................................................................................................
10
6.2 Load Dump
........................................................................................................
10
6.3 Start-Up
............................................................................................................
11
6.4 Efficiency
..........................................................................................................
12
6.5 Thermal Performance
............................................................................................
12
7 Layout and Bill of Material
................................................................................................
14
7.1 Layout
..............................................................................................................
14
7.2 Bill of Materials (BOM)
...........................................................................................
17
List of Figures
1 HPA764 Schematic
.........................................................................................................
3
2 Test Set Up
..................................................................................................................
7
3 Load Step, 0 mA to 600 mA
.............................................................................................
10
4 Load Dump, 500 mA to 0 mA
...........................................................................................
11
5 Start-Up
....................................................................................................................
12
6 Efficiency for the bq51010B versus I
OUT
...............................................................................
12
7 Thermal Image
.............................................................................................................
13
8 bq51010BEVM-764 Layout Example
..................................................................................
14
9 bq51010BEVM-764 Top Assembly
.....................................................................................
15
10 bq51010BEVM-764 Top Layer
..........................................................................................
15
11 bq51010BEVM-764 Bottom Copper Layer
............................................................................
16
bqTESLA is a trademark of Texas Instruments, Inc..
1 SLUUAE3A – August 2013 – Revised December 2013 bq51010BEVM-764 Evaluation Module (WCSP Package)
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated