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DR-BT50

US Model

Canadian Model

AEP Model

UK Model

E Model

SERVICE MANUAL

WIRELESS STEREO HEADSET

SPECIFICATIONS

Ver. 1.0  2007.02

General

Communication System

Bluetooth Specification version 2.0

Output

Bluetooth Specification Power Class 2

Maximum communication range

Line of sight approx. 10 m (30 ft) 

*1

Frequency band

2.4 GHz band (2.4000 GHz – 2.4835 GHz)

Modulation method

FHSS

Compatible Bluetooth Profiles

*2

A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HSP (Headset Profile)
HFP (Hands-free Profile)

Supported Codecs

*3

SBC

*4

, MP3

Transmission range (A2DP)

20 - 20,000 Hz (sampling frequency 44.1 kHz)

Supplied accessory

AC power adaptor (1)
Carrying porch (1)
Operating instruction (1)

*1

The actual range will vary depending on factors such as obstacles
between devices, magnetic fields around a microwave oven, static
electricity, reception sensitivity, aerial’s performance, operating
system,

*2

Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.

*3

Codec: Audio signal compression and conversion format

*4

Subband Codec

Headset

Power source

DC 3.7 V: Built-in lithium-ion
rechargeable battery

Mass

Approx. 180 g (6.4 oz)

Rated power consumption

3.0 W

Receiver

Type

Closed type, dynamic

Driver unit

40 mm dome type

Reproduction frequency range

10 – 25,000 Hz

Microphone

Type

Omni directional, electret condenser

Effective frequency range

100 – 4,000 Hz

Design and specifications are subject to change without notice.

Sony Corporation

Personal Audio Division
Published by Sony Techno Create Corporation

9-887-600-01

2007B02-1
© 2007.02

Summary of Contents for DR-BT50 - Stereo Bluetooth Headset

Page 1: ...ting instruction 1 1 The actual range will vary depending on factors such as obstacles between devices magnetic fields around a microwave oven static electricity reception sensitivity aerial s performance operating system 2 Bluetooth standard profiles indicate the purpose of Bluetooth communication between devices 3 Codec Audio signal compression and conversion format 4 Subband Codec Headset Power...

Page 2: ... printed with the lead free mark LF indicating the solder contains no lead Caution Some printed circuit boards may not come printed with the lead free mark due to their particular size LEAD FREE MARK Unleaded solder has the following characteristics Unleaded solder melts at a temperature about 40 C higher than ordinary solder Ordinary soldering irons can be used but the iron tip has to be applied ...

Page 3: ...power status of the unit Microphone DC IN 3 V jack RESET button Push this button when the unit does not operate properly Pairing information is not deleted by this operation VOL volume button VOL volume button Jog switch Controls various functions when listening to music buttons Jump to previous succeeding groups when listening to music Slider right indication Right unit Ear pad Left unit left ind...

Page 4: ... R ASSY Page 4 2 3 BATTERY HOLDER Page 5 2 4 MAIN BOARD Page 5 2 5 JACK BOARD Page 6 2 6 SWITCH BOARD Page 6 2 7 MIC BOARD Page 6 SET 1 ear pad 5 Remove the solder at 5 places 2 two screws B2 6 3 screw B2 6 4 plate R front sub assy 6 headband assy 7 housing R assy RED RED NAT Marking side WHT BLK driver R to driver L to MAIN board Note Plus terminal is marking with felt tip pen The position uncert...

Page 5: ... 6 4 button panel 2 screw B2 6 3 claw 5 battery holder 6 Remove the solder at 2 places NAT MAIN board RED 2 CNP451 1 connector CN201 4 two claws 3 Remove the solder at 2 places 6 Remove the solder at 3 places 5 MAIN board BLK side A side B RED YEL BLK GRY ...

Page 6: ...claw 5 JACK board RED BLK 35mm 9mm Note When exchange the FFC Flexible Flat cable conductor side Reinforce board SWITCH board CN202 MAIN board CN451 2 6 SWITCH BOARD 1 claw 2 claw 3 SWITCH board 4 Remove the solder at 3 places YEL GRY BLK 2 7 MIC BOARD 1 two screws 2 MIC board ...

Page 7: ...MS Caution Parts face side Parts on the parts face side seen from Side A the parts face are indicated Pattern face side Parts on the pattern face side seen from Side B the pattern face are indicated For printed wiring boards Note X parts extracted from the component side Y parts extracted from the conductor side a Through hole Pattern from the side which enables seeing The other layers patterns ar...

Page 8: ...G ENABLE I FAULT ENABLE I DETECT ENABLE I FAULT ENABLE DEGLITCH DEGLITCH DEGLITCH DEGLITCH RECHARGE PRECHARGE TAPER TERM STAT1 REFERENCE AND BIAS THERMAL SHUTDOWN CHARGE CONTROL TIMER AND DISPLAY LOGIC PG PG TS IC261 BQ24010ADRCR IC251 XC9103D093MR 1 FB VDD VDD VDD 2 CE 3 EXT 5 4 GND VREF WITH SOFT START CE PWM PFM CONTROLER RAMP WAVE GENERATOR OSC BAFFER DRIVER PWM COMPARATOR ERROR AMP CURRENT RI...

Page 9: ...V PIO_05 CHARGE ON OFF 30 RECEIVER TRASMITTER MIC AMP AF AMP BLUETOOTH CONTROL RESET B3 A5 B1 B2 POWER B SWITCH Q201 202 RESET VDD 2 EXT DC DC CONVERTOR 5 J251 DC IN 3V 3 CE S101 D201 IC151 1 8V 1 5V MIC IC201 IC202 5 3 1 1 5V REG FB 1 Q251 L251 L201 BT301 4 5V IC251 IC101 SUB CONTROL IC451 SWICHING STAT1 BATT 9 1 2 7 3 OUT 10 PG IN OUT LX CE VOUT VIN VIN 2 8V IC203 5 3 1 2 8V REG CE VOUT VIN 2V I...

Page 10: ...R129 R139 R137 JC138 R265 C264 JC131 R136 R205 R206 R407 R423 R422 FB423 FB421 C429 VDR422 L251 C421 FB202 BT301 RECHARGEABLE BATTERY LI ION 3 7V C450 C408 C417 C424 TP261 RED NAT TP262 TP269 TP2701 TAP472 FB405 C133 C130 R111 R133 C112 C108 C211 C212 R107 R127 IC202 C253 C109 C224 R452 R112 C111 R109 C425 R101 FB424 C103 C210 FB402 C405 C402 R108 C266 IC204 IC251 R152 L421 C217 R113 R131 R132 VDR...

Page 11: ... TP209 TP208 TP211 R212 R214 R213 R211 S207 R209 R208 TP113 TP114 C122 MIC301 S208 11 11 1 872 503 11 11 1 872 503 11 11 1 872 504 11 11 1 872 504 11 11 1 872 505 BLK 3 GRY 2 YEL 1 C MAIN BOARD Page 10 SWITCH BOARD SIDE A SWITCH BOARD SIDE B JACK BOARD SIDE B JACK BOARD SIDE A MIC BOARD NAT RED 2 1 A MAIN BOARD Page 10 D MAIN BOARD Page 10 B MAIN BOARD Page 10 S205 VOL S206 RESET J251 DC IN 3V ...

Page 12: ...C466 R472 R453 R462 R467 R465 C456 C463 C462 C461 C460 C459 C458 C457 R469 R463 R464 R470 R468 R208 R209 J251 TP254 C264 C263 C262 R265 R261 C266 R264 R263 C483 S201 SPI_CSB SPI_MISO SPI_CLK SPI_MOSI URAT_TX URAT_CTS URAT_RTS RB715W 10k 470 0 0 01 0 1 0 1 0 1 0 047 10V 0 047 10V MIC GND 2P 150k 0 5 68p 56k 0 5 220k 0 5 DC 3 0V GND DC 4 5V GND URAT_RX 100k RN1704 TE85R CXN1450 XC9226A186MR 15nH BQ2...

Page 13: ...t right clock input 10 Not used Open 11 Not used Open 12 HPVDD Power supply 2 8V 13 LHPOUT O L CH audio signal output 14 RHPOUT O R CH audio signal output 15 HPGND Ground 16 LOUT Not used Open 17 ROUT Not used Open 18 AVDD Power supply 2 8V 19 AGND Ground 20 VMID Mid rail reference decoupling terminal 21 Not used Open 22 Not used Open 23 RLINEIN I R CH line signal input Not used 24 LLINEIN I L CH ...

Page 14: ...r in the exploded views are not supplied Abbreviation CND Canadian model KR Korean model 1 A 1231 804 A HOUSING L ASSY 2 1 542 593 12 DRIVER 040F020 3 X 2177 241 1 PLATE L FRONT SUB ASSY 4 3 253 143 01 SCREW B2 6 P TAPPING 5 2 688 747 01 PAD EAR 6 2 685 615 11 HANGER R 7 2 685 617 11 RETAINER SLIDER 8 X 2178 106 1 HEADBAND ASSY 9 2 888 576 11 CAP SLIDER 10 3 703 358 05 PIN PARALLEL DIA 2X16 11 2 8...

Page 15: ... US CND 61 A 1231 813 A MAIN BOARD COMPLETE 62 2 898 053 01 BUTTON VOLUME 63 2 898 060 01 PANEL BUTTON 64 2 898 933 01 CUSHION MIC 65 3 254 082 11 SCREW 66 A 1231 897 A MIC BOARD COMPLETE 67 2 898 059 01 HOLDER MIC 68 2 898 062 01 BUTTON FOLDER 69 2 898 058 01 LIGHT GUIDE 70 2 898 055 01 BUTTON MULTIFUNCTION 71 2 898 052 01 BUTTON POWER 72 2 898 056 01 RING BUTTON 73 A 1231 806 A HOUSING R ASSY 74...

Page 16: ...3 81 CERAMIC CHIP 0 01uF 10 16V C117 1 164 839 11 CERAMIC CHIP 0 5PF 0 25PF 50V C118 1 119 923 11 CERAMIC CHIP 0 047uF 10 10V C119 1 119 923 11 CERAMIC CHIP 0 047uF 10 10V C120 1 164 854 11 CERAMIC CHIP 15PF 5 50V C121 1 100 506 91 CERAMIC CHIP 1uF 20 6 3V C123 1 164 943 81 CERAMIC CHIP 0 01uF 10 16V C130 1 164 874 11 CERAMIC CHIP 100PF 5 50V C133 1 164 874 11 CERAMIC CHIP 100PF 5 50V C151 1 164 9...

Page 17: ... TANTAL CHIP 10uF 20 6 3V C417 1 125 777 11 CERAMIC CHIP 0 1uF 10 10V C418 1 125 777 11 CERAMIC CHIP 0 1uF 10 10V C421 1 100 352 91 CERAMIC CHIP 1uF 20 16V C424 1 119 750 11 TANTAL CHIP 22uF 20 6 3V C425 1 164 874 11 CERAMIC CHIP 100PF 5 50V C428 1 164 874 11 CERAMIC CHIP 100PF 5 50V C429 1 164 874 11 CERAMIC CHIP 100PF 5 50V C430 1 164 874 11 CERAMIC CHIP 100PF 5 50V C431 1 100 506 91 CERAMIC CHI...

Page 18: ...7 11 RES CHIP 100K 5 1 16W R465 1 218 977 11 RES CHIP 100K 5 1 16W R467 1 218 977 11 RES CHIP 100K 5 1 16W R468 1 218 977 11 RES CHIP 100K 5 1 16W R469 1 218 977 11 RES CHIP 100K 5 1 16W R470 1 218 977 11 RES CHIP 100K 5 1 16W R471 1 218 953 11 RES CHIP 1K 5 1 16W R472 1 218 973 11 RES CHIP 47K 5 1 16W R473 1 218 965 11 RES CHIP 10K 5 1 16W SWITCH S101 1 771 844 21 SWITCH TACTILE SMD POWER S209 1 ...

Page 19: ...19 DR BT50 MEMO ...

Page 20: ...TORY Clicking the version allows you to jump to the revised page Also clicking the version at the upper right on the revised page allows you to jump to the next revised page Ver Date Description of Revision 1 0 2007 02 New ...

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